Slicing machine-tools
solutions for crystal growth and machining
The machine-tools is intended for slicing of single crystal sapphire ingots, notably of sapphire monocrystals, as well as for slicing of other hard or superhard materials. Slicing is done by a diamond coated wire
Specification:
Diameter of sliced ingots: up to 500 mm
Length of sliced ingots: up to 300 mm
Wire speed: up to 15 m/s
Number of wafers from one cycle of cutting pieces: up to 150;
Weight of the device: 1310 kg
Typically machine-tools connections
High-efficiency process
Applications:
- Sapphire ingots
- Sapphire tapes
- Sapphire rods
- Silicon crystal
- Hard and extrahard materials
- LED sapphire wafer
- Ceramics and glasses
- Thin extrahard structures